杭州电子科技大学图书馆书目检索系统

Online Public Access Catalogue

题名/责任者:

Antenna-in-package technology and applications / edited by Duixian Liu, Yueping Zhang.

版本说明:

First edition.

出版发行项:

Hoboken, New Jersey : Wiley-IEEE Press, [2020]

ISBN:

9781119556633:

载体形态项:

416 pages ; 24 cm

其他载体形态:

Online version: Antenna-in-package technology and applications First edition. Hoboken, New Jersey : John Wiley & Sons, Inc., [2020] 9781119556640

附加个人名称:

Liu, Duixian, editor.

附加个人名称:

Zhang, Yueping, editor.

论题主题:

Microstrip antennas.

论题主题:

Microelectronic packaging.

中图法分类号:

TN822

书目附注:

Includes bibliographical references and index.

内容附注:

Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida.

摘要附注:

"This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"--

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