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题名/责任者:

Plasma etching processes for interconnect realization in VLSI / edited by Nicolas Posseme

出版发行项:

London : ISTE Press ; Oxford : Elsevier Ltd, c2015

ISBN:

9781785480157 :

ISBN:

1785480154

载体形态项:

xiv, 108 pages : illustrations ; 24 cm

附加个人名称:

Posseme, Nicolas, editor of compilation

论题主题:

Integrated circuits-Very large scale integration

论题主题:

Plasma etching

论题主题:

Molded interconnect devices

中图法分类号:

TN47

书目附注:

Includes bibliographical references (pages [93]-103) and index

内容附注:

Interaction plasma/dielectric -- Porous SiOCH film integration -- Interconnects for tomorrow

摘要附注:

This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions

豆瓣简介：