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题名/责任者:

LCP for microwave packages and modules / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara.

出版发行项:

Cambridge ; New York : Cambridge University Press, 2012.

ISBN:

9781107003781 (hardback)

ISBN:

1107003784 (hardback)

载体形态项:

xiv, 253 p. ; 26 cm.

丛编说明:

The Cambridge RF and microwave engineering series.

丛编统一题名:

Cambridge RF and microwave engineering series.

附加个人名称:

Pham, Anh-Vu H.

附加个人名称:

Chen, Morgan J.

附加个人名称:

Aihara, Kunia.

论题主题:

Microwave devices-Materials.

论题主题:

Microelectronic packaging-Materials.

论题主题:

Liquid crystal devices.

论题主题:

Polymer liquid crystals.

中图法分类号:

TN12

书目附注:

Includes bibliographical references and index.

摘要附注:

"A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering"

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