机读格式显示(MARC)
- 000 01219cam a2200313 i 4500
- 008 200124s2020 paua b 001 0 eng d
- 020 __ |a 9781799846345: |c CNY1168.00
- 020 __ |a 9781799853374 |q paperback
- 040 __ |a NhCcYBP |b eng |e rda |c NhCcYBP |d CEPIEC
- 100 1_ |a Cieciska, Barbara Ewa, |d 1972- |e author.
- 245 10 |a Using lasers as safe alternatives for adhesive bonding : |b emerging research and opportunities / |c Barbara Ewa Cieciska.
- 260 __ |a Hershey, PA : |b Engineering Science Reference, an imprint of IGI Global, |c [2020]
- 300 __ |a xi, 248 pages : |b color illustrations ; |c 24 cm.
- 336 __ |a text |b txt |2 rdacontent
- 337 __ |a unmediated |b n |2 rdamedia
- 338 __ |a volume |b nc |2 rdacarrier
- 490 1_ |a Advances in chemical and materials engineering (ACME) book series
- 500 __ |a "Research Insights" -- taken from front cover.
- 504 __ |a Includes bibliographical references and index.
- 650 _0 |a Lasers |x Industrial applications.
- 830 _0 |a Advances in chemical and materials engineering (ACME) book series.