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• 000 01318nam a2200361 i 4500

• 001 0000792427

• 003 __Uk

• 005 20201123145700.0

• 008 200824s2020 sz a b 101 0 eng d

• 015 __ |a GBC058243 |2 bnb

• 020 __ |a 9783035714586

• 020 __ |z 9783035734584

• 040 __ |a StDuBDS |b eng |c StDuBDS |e rda |e pn

• 082 04 |a 620.11 |2 23

• 090 __ |a TB3/BM1

• 093 __ |a TB3 |2 5

• 111 2_ |a International Conference on the Physical Properties and Application of Advanced Materials |n (13th : |d 2018 : |c Hanoi, Vietnam), |j creator.

• 245 10 |a Physical properties and application of advanced materials / |c edited by Kenji Matsuda, Pham Mai Khanh, Dang Quoc Khanh, Le Van Lich.

• 260 __ |a Baech : |b Trans Tech Publications, |c 2020.

• 300 __ |a ix, 244 pages : |b illustrations ; |c 24 cm.

• 336 __ |a text |2 rdacontent

• 336 __ |a still image |2 rdacontent

• 337 __ |a unmediated |2 rdamedia

• 338 __ |a volume |2 rdacarrier

• 490 1_ |a Materials science forum, |x 0255-5476 ; |v 985

• 504 __ |a Includes bibliographical references and index.

• 650 _0 |a Materials |v Congresses.

• 700 1_ |a Matsuda, Kenji, |e editor.

• 700 1_ |a Khanh, Pham Mai, |e editor.

• 700 1_ |a Khanh, Dang Quoc, |e editor.

• 700 1_ |a Lich, Le Van, |e editor.

• 830 _0 |a Materials science forum ; |v 985.

• 920 __ |a 233030 |z 1