机读格式显示(MARC)

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• 001 0000950569

• 005 20240919112600.0

• 010 __ |a 978-7-111-75580-7 |d CNY128.00

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• 101 1_ |a chi |c eng |c ger

• 102 __ |a CN |b 110000

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• 106 __ |a r

• 200 1_ |a 扇出晶圆级封装、板级封装及嵌入技术 |A shan chu jing yuan ji feng zhuang 、 ban ji feng zhuang ji qian ru ji shu |d Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces |e hige performance compute and system-in-package |e 高性能计算(HPC)和系统级封装(SiP) |f (美)贝思·凯瑟(BethKeser)，(德)斯蒂芬·克罗纳特编著 |g 吴向东等译 |z eng

• 210 __ |a 北京 |c 机械工业出版社 |d 2024

• 215 __ |a 16,252页 |d 24cm

• 225 2_ |a 半导体与集成电路关键技术丛书 |A Ban Dao Ti Yu Ji Cheng Dian Lu Guan Jian Ji Shu Cong Shu

• 461 _0 |1 2001 |a 半导体与集成电路关键技术丛书

• 510 1_ |a Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces |e hige performance compute and system-in-package |z eng

• 517 1_ |a 高性能计算(HPC)和系统级封装(SiP)

• 606 0_ |a 集成电路 |A Ji Cheng Dian Lu |x 封装工艺

• 690 __ |a TN405 |v 5

• 701 _0 |c (美) |a 凯瑟 |A she she |c (Keser, Beth) |4 编著

• 701 _1 |c (德) |a 克罗纳特 |A ke luo na te |b 斯蒂芬 |4 编著

• 702 _0 |a 吴向东 |A wu xiang dong |4 译

• 801 _0 |a CN |b HDUL |c 20240919

• 905 __ |a HDUL |d TN405/210

• 920 __ |a 233030 |z 1