机读格式显示(MARC)
- 000 02834cam a2200337 i 4500
- 008 180409s2018 enka b 001 0 eng d
- 020 __ |a 9780081021392 |c CNY1417.32
- 040 __ |a NhCcYBP |b eng |e rda |c NhCcYBP
- 050 _4 |a TK7871.99.M44 |b C56 2018
- 082 04 |a 537.6/223 |2 23
- 245 00 |a CMOS past, present and future / |c Henry H. Radamson, Jun Luo, Eddy Simoen, Chao Zhao.
- 260 __ |a Duxford : |b Woodhead Publishing, |c 2018.
- 300 __ |a vii, 263 pages : |b illustrations (some color) ; |c 24 cm.
- 336 __ |a text |b txt |2 rdacontent
- 337 __ |a unmediated |b n |2 rdamedia
- 338 __ |a volume |b nc |2 rdacarrier
- 490 1_ |a Woodhead Publishing series in electronic and optical materials
- 504 __ |a Includes bibliographical references and index.
- 505 0_ |a 1. Brief introduction CMOS applications in our daily life; 2. Basic definitions and equations; 3. Electrical measurements (IV, short channel effects, mobility and noise); 4. CMOS Architecture; 5. Strain engineering (stressor materials in source/drain regions, strain induced by processing, stress liners); 6. High-k and metal gate (Almost all known high-k materials and metal gates); 7. Channel materials (Ge, GeSn, SiGe, Graphene and other II-D crystals, III-V compounds); 8. Contacts (Silicide formation, contact resistance, parasitic contacts); 9. Integration with photonic components (CMOS with lasers, detectors); 10. Technology roadmap (starting from 50's to unknown future); 11. Authors' final words.
- 520 __ |a CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends. The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements.
- 650 _0 |a Metal oxide semiconductors, Complementary.
- 700 1_ |a Luo, Jun, |e author.
- 700 1_ |a Simoen, E. |q (Eddy), |e author.
- 700 1_ |a Zhao, Chao, |e author.
- 830 _0 |a Woodhead Publishing series in electronic and optical materials.