机读格式显示(MARC)
- 000 02540cam a2200361 i 4500
- 008 191213s2020 nju b 001 0 eng
- 020 __ |a 9781119556633: |c CNY1053.00 |q cloth
- 020 __ |z 9781119556640 |q adobe pdf
- 020 __ |z 9781119556657 |q epub
- 040 __ |a DLC |b eng |e rda |c DLC
- 050 00 |a TK7871.67.M5 |b A58 2020
- 082 00 |a 621.382/4 |2 23
- 245 00 |a Antenna-in-package technology and applications / |c edited by Duixian Liu, Yueping Zhang.
- 260 __ |a Hoboken, New Jersey : |b Wiley-IEEE Press, |c [2020]
- 300 __ |a 416 pages ; |c 24 cm
- 336 __ |a text |b txt |2 rdacontent
- 337 __ |a unmediated |b n |2 rdamedia
- 338 __ |a volume |b nc |2 rdacarrier
- 504 __ |a Includes bibliographical references and index.
- 505 0_ |a Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida.
- 520 __ |a "This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"-- |c Provided by publisher.
- 650 _0 |a Microstrip antennas.
- 650 _0 |a Microelectronic packaging.
- 700 1_ |a Liu, Duixian, |e editor.
- 700 1_ |a Zhang, Yueping, |e editor.
- 776 08 |i Online version: |t Antenna-in-package technology and applications |b First edition. |d Hoboken, New Jersey : John Wiley & Sons, Inc., [2020] |z 9781119556640 |w (DLC) 2019057783