机读格式显示(MARC)
- 000 02178cam a2200337 i 4500
- 008 190426s2019 nyu b 001 0 eng
- 040 __ |a DLC |b eng |c DLC |e rda |d DLC
- 050 00 |a TK7870.25 |b .Y438 2019
- 100 1_ |a Yeh, L.-T. |q (Lian-Tuu), |d 1944- |e author.
- 245 10 |a Thermal design of liquid cooled microelectronic equipment / |c by Lian-Tuu Yeh.
- 260 __ |a New York, NY : |b The American Society of Mechanical Engineers, |c [2019]
- 300 __ |a 350 pages ; |c 22 cm
- 336 __ |a text |b txt |2 rdacontent
- 337 __ |a unmediated |b n |2 rdamedia
- 338 __ |a volume |b nc |2 rdacarrier
- 504 __ |a Includes bibliographical references and index.
- 520 __ |a "With the demands of increased system functionalities and performance, the system power density of microelectronics equipment is continuously increased at a fast pace. This is especially true for the telecommunications systems because the network traffic in the industry has grown very rapidly every year. For the high power air cooled systems, large high performance fans are becoming a must for the systems in order to provide the necessary air flow rates. Two major concerns about these large fans are the power consumption and the acoustic noise of the fans. In addition, the increase in the system power results in a significant increase in the operation cost of the equipment as well as its host facilities such as the date centers. Liquid cooling can not only resolve the above mentioned issues related to high power air-cooled systems but also enhance its system performance and reliability. For some cases, the system power is too high to be cooled by air thermally. The only solution to such situations is adopting the liquid cooling"-- |c Provided by publisher.
- 650 _0 |a Electronic apparatus and appliances |x Cooling.
- 650 _0 |a Electronic apparatus and appliances |x Thermal properties.
- 650 _0 |a Microelectronics |x Equipment and supplies.
- 650 _0 |a Cold plates (Electronics)