机读格式显示(MARC)
- 000 02236cam a2200349 a 4500
- 008 120405s2012 enk b 001 0 eng
- 020 __ |a 9781107003781 (hardback)
- 020 __ |a 1107003784 (hardback)
- 040 __ |a DLC |b eng |c DLC |d YDX |d BTCTA |d UKMGB |d YDXCP |d YNK |d CDX |d BWX |d OCLCO
- 050 00 |a TK7876 |b .L387 2012
- 082 00 |a 621.381/3 |2 23
- 245 00 |a LCP for microwave packages and modules / |c [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara.
- 260 __ |a Cambridge ; |a New York : |b Cambridge University Press, |c 2012.
- 300 __ |a xiv, 253 p. ; |c 26 cm.
- 490 1_ |a The Cambridge RF and microwave engineering series.
- 504 __ |a Includes bibliographical references and index.
- 520 __ |a "A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering"
- 650 _0 |a Microwave devices |x Materials.
- 650 _0 |a Microelectronic packaging |x Materials.
- 650 _0 |a Liquid crystal devices.
- 650 _0 |a Polymer liquid crystals.
- 700 1_ |a Pham, Anh-Vu H.
- 700 1_ |a Chen, Morgan J.
- 830 _0 |a Cambridge RF and microwave engineering series.